Umesh Swamy

COVER LETTER

RE: Cover Letter for Job Opportunity.

Dear Selection Committee,

As a Systems Hardware Engineer (Electronics HW Engineer) with proven track record in Embedded Electronics Engineering domain, it is with great pleasure that I tender my application to apply for a Job. In addition to my formal education and all assorted trainings as part of industrial experience makes me the perfect candidate for this opportunity in your organisation in Germany.

After over 12 years of experience with several MNCs in INDIA, I have acquired great skills which when use along with right opportunity will help me grow and be part of work force driving the German economy. I also have excellent collaboration skills and always work effectively across different teams. I’m known for being an adept consensus builder.

Ever since when I was a little kid German education system has always made me wonder, when I think about a country with such a strong educational base in my head it makes the perfect civilization I could imagine, all the German people I have met so far along with my personal research gives me the faith to believe so. Apart from my professional career and my passion towards a more evolved lifestyle my love for cars and automotive technology always takes me to Germany in my imagination. The thought of cars like BMW, Mercedes Benz and Audi on the autobahn always mesmerizes me. The cultural diversity and open culture of Deutschland and the technologically advanced country makes this place a complete I look forward to dedicating my professional and personal life to.

With my experience and skill set, I’m confident that I can secure a good job, so that I can look forward to a Blue Card. I have already spoken to my travel agent regarding the travel arrangements and accommodation for initial few months.

In the interim, thank you for reviewing this letter and the attached material.

Sincerely,

Umesh

SENIOR SYSTEMS ENGINEER – FISKER INC.
◦ Electric Vehicle Telematics, Gateway and Computation sub-system HW developmental
activity.
• Design reviews and follow-up meetings with external automotive system design partner.
• Board design with highspeed interface- LPDDR4, PCIe Gen-3, SGMII, XFI interfaces.
• Wifi-6, 5G module component engineering, antenna selection in automotive applications.
• Power scheme conceptualization for multisensor supply requirements, together with
high-speed digital interfaces.
• Ansys SIwave usage for signal integrity analysis of PCB design.

29/10/2018 – 16/11/2022 – Bengaluru, India
SENIOR HARDWARE ENGINEER – SIEMENS TECHNOLOGY AND SERVICES PVT. LTD.
◦ Com-Express carrier high-speed board hardware design, an analytic and computation
platform for Gas Chromatography System in Oil and Gas industry.
• DDR4 DIMM 2GB, component engineering.
• Pre- and Post-Layout Signal Integrity analysis of DDR4 DIMM interface with COM carrier
board.
• Detailed design validation and test report generation of high speed interfaces, PCI-e
Gen3, 1000Base-T, DDR4, USB2.0 using high-end oscilloscope with in-built eye masks.
◦ 2-Wire Field Transmitter hardware development for Industrial process instrumentation.
• Design improvement in 2-wire transmitter, implementation of compensation techniques
for parameter variation wrt temperature of devices used as current mirrors and error
amplifier.
• Realization of electronic circuit, hysteretical mechanism to transfer energy from power
limited 2-wire current loop to sensor load.
◦ Documentation (Architecture, Module Tests, HW-HW Integration, HW-SW Integration).
◦ HW design and development tools include HyperLynx for Signal Integrity analysis.
◦ Schematic Entry using Dx-Designer, BOM Generation.
◦ Layout instruction document and PCB-Gerber Review.
◦ Testing – Board Bring-Ups, Functional Tests, Lab-view for Test Automation, Production Data
Analysis.
2/2
◦ FMEA of field transmitters, component derating, safe fail, load table preparation for
explosion proof intrinsic protection concept implementation in field transmitter.

14/04/2016 – 28/10/2018 – Bengaluru, India
SENIOR TEST ENGINEER – TESSOLVE SEMICONDUCTOR PVT. LTD.
◦ Characterization of Power-MOSFET and IGBT Gate-Drive on ATE platform.
◦ Detailed test plan preparation covering all device parameters to be validated in
production environment
• Test program development in C, using Visual Basic environment.
• Load board / Device interface board design using Altium –
• Relay matrix to switch the connection of instrument resource to pin
under test and necessary signal processing circuitry.
• Device parameters validated include on-die ESDs, Over-voltage
protection circuitry, Short circuit protection circuitry, Maximum output
current, Propagation delay, Switching frequency, Isolation, Level
shifting.. etc.,
◦ Test work-package release in production house in Malaysia.
◦ Lot qualification, test process capability analysis to meet the 6sigma quality requirements of
customer.
◦ Test Time Reduction, Yield Optimization, Platform conversion.

10/09/2014 – 13/04/2016 – Bengaluru, India
HARDWARE ENGINEER – SENSEL TELEMATICS PVT. LTD.
◦ From requirement to hardware realization of Vehicle Tracking Systems for light commercial
vehicles
◦ Requirement study for realizable feasibility.
◦ Hardware Architecture document, Component Engineering,
◦ Proto build and POC of VTS using off-the-shelf GNSS, GPRS modules,
• Product technology include 32-bit MCU from ST-Microelectronics, accelerometer,
Flash, SD-card, anti-theft features, analog-digital inputs and outputs for vehicle health
monitor and control, GPS-GSM module with internal antennas, IP66 enclosure.
• Development tools Schematic Entry and PCB Layout design using KiCAD, detailed
test paln preparation.
◦ Testing using lab equipments during board bring-up phase, functional testing, and IEC61000 EMIEMC
Test Engineering
◦ EMI - EMC compliance testing of system for certified from TUV, Bangalore.
◦ Development of variants of VTS to use the products as real time location systems operated
solely on battery with self-life of operation for up to 5 Years.

04/07/2011 – 06/03/2014 – Bengaluru, India
3/2
DESIGN ENGINEER – PROCESSOR SYSTEMS INDIA PVT. LTD.
◦ Learning activities to support the on-going projects encompassing building bread-board
circuits of ADCs ad DACs testing the performance, board bring-ups, schematic net-list
review, Layout instruction document preparation and review.
◦ Interaction with external vendor for board manufacturing and assembly activities.
◦ BOM inventory maintenance, Purchase of components
◦ Ownership of Nurse Call System feature enhancement and development project, a
medical health-care system
• Technical Documentation, Component engineering, BOM optimization,
schematic entry and layout supervision
• Detailed HW design validation using bench instruments
• Technology – 32bit MCU, ARM-M4 Cortex from Atmel, on-board eeprom,
battery powered, Zigbee protocol based systems encompassing Gateway-
Router and End_devices.
• End-device design in 4-layer flex pcb to enhance aesthetics of wearable
devices
• Support, maintaining activity while mass producing the sub-systems by coordinating
with OEM vendor from Taiwan.
• Component engineering to find replacement to obsolete and NRD parts

BACHELOR OF ENGINEERING IN ELECTRONICS AND COMMUNICATION
VISVESVARAYA TECHNOLOGICAL UNIVERSITY, Belagavi, Karnataka, INDIA