- MEMS, semiconductor, packaging technologies, etc.
- Drive engineering & process tasks targeting the highest majority level of developed processes for R&D & manufacturing.
- Analyze & solve problems in the business domain of Advanced Packaging Technologies using standard quality engineering methods, such as SPC/CPK/CMK, MSA, & FMEA.
- Manage engineering projects with internal & external partners.
- Degree in Physics, Chemistry, Mechanical/Electrical Engineering or a similar field
- years of relevant work experience in high tech industrial areas (e.g. MEMS, semiconductor, packaging technologies, etc.)
- Deep knowledge in semiconductor packaging technologies & processes.
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Process Engineering Lead - Munich, Deutschland - European Recruitment
Beschreibung
Process Engineering Lead - MEMS / Semiconductor / Die-Attach
Bavaria, Germany
I am looking for Process Engineering Leaders with 8+ years experience in high-tech industries such as:
This position is based just outside of Munich(~40-minute train commute) working for a Global Leading Tech company.
Responsibilities:
Requirements:
If this sounds interesting please apply directly or send your CV to -
Key words:
#Semiconductor #MEMS #Packaging #ProcessEngineer #DieAttach
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