- Oversee the production line set-up and maintenance.
- Drive quality and productivity measures to ensure a smooth production process.
- Ensure continuous improvement of fundamental processes technology and equipment to improve wafer quality and tool productivity.
- Collaborate with process integration, manufacturing, and other cross-module teams to ensure consistent high-quality wafer production and delivery.
- Develop a deliberate talent roadmap to identify, build and lead the operations team, cultivate a culture of continuous improvement and professional growth.
- Proactively take ownership and provide critical leadership of day-to-day operations, resource planning, prioritization, and cross-functional management.
- Mentor engineers to ensure smooth and efficient operations.
- Ensure vigilance in health and safety compliance.
- A minimum of a Master's Degree in engineering or scientific fields such as Materials Science, Electrical Engineering, Chemical Engineering, and Mechanical Engineering.
- At least 8 years of experience in the semiconductor industry, with a particular focus upon one of the following expertise: Litho, Etch, WET, CVD, PVD, ALD, CMP, Ion Implantation, Single Wafer Annealing, Oxidation furnace, Furnace, Manufacturing, Yield enhancement, Process Integration, and respective equipment knowledge.
- Experience with leading company of IDM in semiconductor industry is a strong plus.
- Solid technical understanding of IC processing equipment and integrated process flow.
- A strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
- Fluent in English.
- German and/or Mandarin a strong plus.
- Self-starter, highly organized, with an ability to work independently.
- Displays seasoned intercultural awareness and top-level business management, interpersonal, and facilitation skills.
- Passion for technology and for leading and developing of teams.
- Flexibility to work in a dynamic start-up environment.
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Manager of Process Integration - Dresden, Deutschland - TSMC
Beschreibung
European Semiconductor Manufacturing Company (ESMC) is a joint venture between four technology leaders, TSMC, Bosch, Infineon and NXP, to establish a state-of-the-art semiconductor fab in the heart of Europe. ESMC represents our shared commitment to strengthening the European semiconductor ecosystem.
To help us build the foundation of our future fab in Dresden, Germany, we are assembling a team of passionate;
(Senior) Managers of Process Integration / Module / Yield
Job Summary:
Lead the technology transfers for the new semiconductor fab establishment and elevate engineering and manufacturing excellence in the specific technology fields.
Build and establish the engineering and operations teams and ensure an effective ramp-up and transition plan whilst maintaining highest standards in efficiency, quality, and productivity.
Key Responsibilities:
Qualifications and Education:
Language Skills & Attributes:
Each journey starts with a first step.
Joining ESMC at this early stage will provide you with the unique opportunity to actively shape the future of the fab in Dresden, boost your career and put your true potential to the test. You will be working in a fast paced, international startup environment whilst at the same time having access to the experience, talent, and resources of the largest and most advanced semiconductor manufacturer in the world, TSMC. You have ample opportunities to learn about TSMC Operations, Digital Transformation, and various advanced Facilities related topics, both in Taiwan and other sites around the world.
Behind the world's most advanced technology are real people with real passion.
Our success is fueled by our core values: Integrity, Commitment, Innovation and Customer Trust (ICIC).
At ESMC we believe in the power of inclusive leadership and passion. We demonstrate this in our commitment to our people vision: create an inclusive environment to inspire passion and enable the best in YOU.